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Modeling of Micro and Nanoparticle Control and Removal in Microtrenches

Nano and Micro-contamination is responsible for most of the yield losses in volume manufactured microstructures such as ICs and in Slider Fabrication Process in Hard Disk Drive Manufacturing. As the Fly height and track pitch are getting smaller, it becomes more critical to control contaminant nanoparticles during hard disk drive manufacturing. Also particle removal from the patterned surface is a tremendous challenge in semiconductor manufacturing and nanomanufacturing. A computational fluid dynamic model has been developed to model the velocity field in the trench. The adhesion force and double layer force as well as the drag force which is derived from the velocity field are measured and used to calculate the moment ratio. The moment ratio specifies the possibility of particle detachment. Once the particle is removed from the surface the vortices and circulation zones take the particle out of the trench. The particle removal from the trench and the time required for the particles to move out of the trench are modeled and presented in the first part of the presentation. High removal even close to the bottom of the trench has been shown by both experimental and numerical results.